栅阵列(BGA)和芯片级封装(CSP)互连的高封装密度与堆叠式封装 (POP) 设计相结合。增强功能且保留足迹。Alpha 已经设计可浸焊剂和浸锡膏,可通过卓越的流程重复实现严密控制。
堆叠式封装应用产品
焊膏
Product | Lead-Free | SnPb | Low Temp | High Reliability | Low Ag | Water Soluble |
PoP-33 | X |
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PoP-34 |
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助焊剂
PoP-707
Alpha 模板
Alpha Cut Alpha Nickel-Cut Alpha Form Alpha Tetrabond
| Alpha Repair Alpha Squeegee Alpha Inspect Alpha Step
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